Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/13/2016
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Application #:
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15057302
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Filing Dt:
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03/01/2016
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Publication #:
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Pub Dt:
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06/23/2016
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Inventors:
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Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin
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Title:
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METHOD OF FORMING BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & ASSOCIATES |
| 629 EUCLID AVE. |
| SUITE 1000 |
| CLEVELAND, OH 44114 |
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