Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2017
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Application #:
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14662610
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Filing Dt:
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03/19/2015
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Publication #:
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Pub Dt:
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09/22/2016
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Inventors:
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Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia
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Title:
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A PACKAGE STRUCTURE HAVING AN INTEGRATED WAVEGUIDE CONFIGURED TO COMMUNICATE BETWEEN FIRST AND SECOND INTEGRATED CIRCUIT CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| FRANK V. DEROSA |
| 48 SOUTH SERVICE ROAD, SUITE 100 |
| RYAN, MASON & LEWIS, LLP |
| MELVILLE, NY 11747 |
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