Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2017
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Application #:
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14062988
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Filing Dt:
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10/25/2013
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Publication #:
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Pub Dt:
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03/13/2014
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Inventors:
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Yoshiaki KITO, Hiroshi Shirasu, Masahiro Yoshihashi, Daisuke Yuki, Kazuhiro Suzuki et al
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Title:
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SUBSTRATE BONDING APPARATUS, SUBSTRATE HOLDING APPARATUS, SUBSTRATE BONDING METHOD, SUBSTRATE HOLDING METHOD, MULTILAYERED SEMICONDUCTOR DEVICE, AND MULTILAYERED SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12-1, YURAKUCHO 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8331 |
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| FINNEGAN HENDERSON |
| 901 NEW YORK AVE |
| WASHINGTON, DC 20001 |
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