Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/17/2017
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Application #:
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14868798
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Filing Dt:
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09/29/2015
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Publication #:
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Pub Dt:
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01/21/2016
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Inventors:
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JASON CHEN, WEN CHU, CHANG-HWANG HUA
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Title:
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STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICES AND A FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK, GUISHAN DISTRICT |
| TAOYUAN CITY, TAIWAN |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO ROAD, SUITE 310 |
| FAIRFAX, VA 22033 |
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