Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2017
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Application #:
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13024156
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Filing Dt:
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02/09/2011
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Publication #:
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Pub Dt:
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08/11/2011
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Inventors:
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Yu-Lin YEN, Ming-Kun Yang, Long-Sheng Yeou, Tsang-Yu Liu
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Title:
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CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| TAOYUAN COUNTY |
| JHONGLI CITY, TAIWAN 32062 |
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| WEN LIU |
| 444 S. FLOWER STREET, SUITE 1750 |
| LOS ANGELES, CA 90071 |
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