Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2017
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Application #:
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14486107
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Filing Dt:
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09/15/2014
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Publication #:
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Pub Dt:
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09/24/2015
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Inventors:
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Kuei-Sen Cheng, Hsi-Hsing Lo, Jui-Chang Chou, Yao-Sheng Lai, Yueh-Min Liu
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Title:
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ELECTRODEPOSITED COPPER FOIL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7F., NO. 301, SONGJIANG RD. |
| ZHONGSHAN DISTRICT |
| TAIPEI CITY, TAIWAN 104 |
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| YU LU, MCCARTER & ENGLISH, LLP |
| 265 FRANKLIN STREET |
| BOSTON, MA 02110 |
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