Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/21/2017
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Application #:
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14361683
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Filing Dt:
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05/29/2014
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Publication #:
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Pub Dt:
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11/13/2014
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Inventors:
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Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk et al
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Title:
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Method of Bonding Two Substrates and Device Manufactured Thereby
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| COLOSSEUM 15 |
| ENSCHEDE, NETHERLANDS 7521 PV |
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| BOZICEVIC, FIELD & FRANCIS LLP |
| 1900 UNIVERSITY AVENUE |
| SUITE 200 |
| EAST PALO ALTO, CA 94303 |
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