Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/07/2017
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Application #:
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15204220
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Filing Dt:
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07/07/2016
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Publication #:
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Pub Dt:
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01/19/2017
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Inventors:
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Giovanni del Rosso, Luis Henrique Hecker de Carvalho et al
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Title:
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SOLDERLESS ELECTRICAL INTERCONNECTIONS IN A HIGH SPEED PHOTONIC PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| RUA DR. RICARDO BENETTON MARTINS, S/N |
| CAMPINAS, BRAZIL 13086902 |
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| HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
| 45 SOUTH SEVENTH STREET |
| SUITE 2700 |
| MINNEAPOLIS, MN 55402-1683 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 369 INVERNESS PKWY |
| ENGLEWOOD, COLORADO 80112 |
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| K&L GATES LLP |
| 925 4TH AVE. |
| SEATTLE, WA 98104-1158 |
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