Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/2017
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Application #:
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14758021
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Filing Dt:
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06/26/2015
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Publication #:
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Pub Dt:
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12/17/2015
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Inventors:
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Jeong Hyun Choi, Jung Ho Kong, Sin-Won Kang, Sang Hyun Cho
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Title:
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RESIN FOR BLISTER PACKAGE AND PREPARATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 86, CHEONGGYECHEON-RO |
| JUNG-GU |
| SEOUL, KOREA, REPUBLIC OF 100-797 |
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| LDLK&M |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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