Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/2017
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Application #:
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14725268
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Filing Dt:
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05/29/2015
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Publication #:
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Pub Dt:
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03/10/2016
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Inventors:
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Jeongwon Yoon, Boin Noh, Baikwoo Lee, Hyunsuk Chun
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| ONELLO & MELLO LLP |
| THREE BURLINGTON WOODS DRIVE |
| SUITE 203 |
| BURLINGTON, MA 01803-4532 |
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