Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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13349405
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Filing Dt:
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01/12/2012
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Publication #:
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Pub Dt:
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07/18/2013
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Inventors:
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Wen-Hsiung Lu, Yi-Wen Wu, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu
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Title:
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Package on Package Interconnect Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C. |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE FOURTH INVENTOR'S LAST NAME PREVIOUSLY RECORDED ON REEL 027843 FRAME 0004. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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