Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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15065992
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Filing Dt:
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03/10/2016
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Inventors:
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Zhi-Zhong ZHUANG, You-Wei LIN, Chih-An YANG
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Title:
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CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4F-1, NO. 26, TAI-YUAN STREET |
CHUPEI |
HSINCHU HSIEN, TAIWAN 302 |
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EDELL, SHAPIRO & FINNAN, LLC |
LAWRENCE D. EISEN |
9801 WASHINGTONIAN BLVD., SUITE 750 |
GAITHERSBURG, MD 20878 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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NO. 1, DUSING 1ST RD. , HSINCHU SCIENCE PARK |
HSINCHU CITY, TAIWAN 30078 |
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MCCLURE, QUALEY & RODACK, LLP |
280 INTERSTATE NORTH CIRCLE SE |
SUITE 550 |
ATLANTA, GA 30339 |
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