Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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14855397
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Filing Dt:
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09/16/2015
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Publication #:
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Pub Dt:
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10/27/2016
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Inventor:
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Shih-Wen Chou
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Title:
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MULTI-CHIP PACKAGE STRUCTURE HAVING BLOCKING STRUCTURE, WAFER LEVEL CHIP PACKAGE STRUCTURE HAVING BLOCKING STRUCTURE AND MANUFACTURING PROCESS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, |
| HSINCHU, TAIWAN |
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| CANON'S COURT , 22 VICTORIA STREET , |
| HAMILTON, BERMUDA HM12 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, TAIWAN |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, TAIWAN |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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