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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9659763
Issue Dt:
05/23/2017
Application #:
12989353
Filing Dt:
01/04/2011
Publication #:
20110111218
Pub Dt:
05/12/2011
Inventors:
Hyun Jee Yoo, Dong Han Kho, Jang Soon Kim, Hyo Soon Park, Jong Wan Hong, Hyo Sook Joo
Title:
EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
025582/0294Recorded: 01/04/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YOO, HYUN JEE
Exec Dt:
12/30/2010
KHO, DONG HAN
Exec Dt:
12/30/2010
KIM, JANG SOON
Exec Dt:
12/30/2010
PARK, HYO SOON
Exec Dt:
12/30/2010
HONG, JONG WAN
Exec Dt:
12/30/2010
JOO, HYO SOOK
Exec Dt:
12/30/2010
Assignee:
LG CHEM, LTD.
20, YOIDO-DONG, YOUNGDUNGPO-GU
SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 150-721
Correspondent:
MCKENNA LONG & ALDRIDGE LLP
1900 K STREET, NW
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
058295/0068Recorded: 11/04/2021Pages: 225
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
LG CHEM, LTD.
Exec Dt:
10/27/2021
Assignee:
LG ENERGY SOLUTION, LTD.
PARC. 1, TOWER ONE
108 YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07335
Correspondent:
DENTONS US LLP
1900 K STREET NW
WASHINGTON, DC 20006

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