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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/23/2017
Application #:
14469811
Filing Dt:
08/27/2014
Publication #:
Pub Dt:
03/05/2015
Inventor:
Chun Ho FAN
Title:
CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE
Assignment: 1
Reel/Frame:
034826/0242Recorded: 01/28/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/25/2015
Assignee:
RM 18, 15/F., INTERNATIONAL TRADE CENTER,
11-19 SHA TSUI ROAD,
TSUEN WAN, HONG KONG
Correspondent:
KEATING & BENNETT, LLP
1800 ALEXANDER BELL DRIVE
SUITE 200
RESTON, VA 20191

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