Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/20/2017
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Application #:
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14442938
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Filing Dt:
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05/14/2015
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Publication #:
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Pub Dt:
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10/22/2015
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Inventor:
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Naoki Sakota
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Title:
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FLIP-CHIP BONDING METHOD AND SOLID-STATE IMAGE PICKUP DEVICE MANUFACTURING METHOD CHARACTERIZED IN INCLUDING FLIP-CHIP BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22-22, NAGAIKE-CHO, ABENO-KU |
| OSAKA-SHI, OSAKA, JAPAN 545-8522 |
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| NIXON & VANDERHYE, PC |
| 901 NORTH GLEBE ROAD, 11TH FLOOR |
| ARLINGTON, VA 22203 |
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