Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/27/2017
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Application #:
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15214475
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Filing Dt:
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07/20/2016
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Inventors:
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Chih-Hua Chen, Hao-Yi Tsai, Yu-Jen Cheng, Yu-Chih Huang, Chih-Wei Lin, Yu-Feng Chen et al
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Title:
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SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, 100 TAIWAN |
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