Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/04/2017
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Application #:
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15168235
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Filing Dt:
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05/30/2016
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Publication #:
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Pub Dt:
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12/01/2016
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Inventors:
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Zeng LI, Jun-Cheng LU, Tao WANG, Zheng-Fen WAN, Zhen-Qing ZHAO
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Title:
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POWER MODULE PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.252, SHANYING RD., GUISHAN DIST. |
| TAOYUAN CITY, TAIWAN 333 |
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| CKC & PARTNERS CO., LTD. |
| 12TH FLOOR, RUTTONJEE HOUSE |
| 11 DUDDELL STREET |
| HONG KONG, HONG KONG |
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