Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/11/2017
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Application #:
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15209964
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Filing Dt:
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07/14/2016
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Inventors:
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Matthieu Lagouge, Qing Zhang, Mohommad Choudhuri, Gul Zeb
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Title:
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Method of Integrating a Copper Plating Process in a Through-Substrate-Via (TSV) on CMOS Wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6501 WILLIAM CANNON DRIVE |
AUSTIN, TEXAS 78735 |
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JERE L. POLMATIER |
WHYTE HIRSCHBOECK DUDEK S.C. |
555 EAST WELLS STREET, SUITE 1900 |
MILWAUKEE, WI 53202 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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NXP USA, INC. |
6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TX 78735 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016.
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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NXP USA, INC. |
6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TX 78735 |
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09/23/2024 08:20 PM
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