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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9724869
Issue Dt:
08/08/2017
Application #:
14583940
Filing Dt:
12/29/2014
Publication #:
20160192474
Pub Dt:
06/30/2016
Inventors:
Paavo NISKALA, Jarmo SAASKI, Pasi RAAPPANA, Mikko HEIKKINEN, Mikko SIPPARI et al
Title:
MULTILAYER STRUCTURE FOR ACCOMMODATING ELECTRONICS AND RELATED METHOD OF MANUFACTURE
Assignment: 1
Reel/Frame:
036887/0508Recorded: 10/27/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NISKALA, PAAVO
Exec Dt:
10/19/2015
SAASKI, JARMO
Exec Dt:
10/19/2015
RAAPPANA, PASI
Exec Dt:
10/19/2015
HEIKKINEN, MIKKO
Exec Dt:
10/19/2015
SIPPARI, MIKKO
Exec Dt:
10/19/2015
TORVINEN, JARKKO
Exec Dt:
10/19/2015
KERANEN, ANTTI
Exec Dt:
10/19/2015
Assignee:
TACTO TEK OY
TAKATIE 6
KEMPELE, FINLAND FI-90440
Correspondent:
YOUNG AND THOMPSON
209 MADISON STREET
SUITE 500
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
042581/0430Recorded: 05/30/2017Pages: 2
Conveyance:
CHANGE OF ASSIGNEES ADDRESS
Assignor:
TACTO TEK OY
Exec Dt:
05/10/2017
Assignee:
TACTO TEK OY
AUTOMAATIOTIE 1,
OULUNSALO, FINLAND 90460
Correspondent:
CARTER, DELUCA, FARRELL & SCHMIDT, LLP
445 BROAD HOLLOW ROAD
SUITE 420
MELVILLE, NY 11747

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