Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14581624
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Filing Dt:
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12/23/2014
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Publication #:
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Pub Dt:
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10/29/2015
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Inventors:
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Hirokazu OKADA, Hiroshi URAGAMI, Tsuyoshi AMAKAWA, Muneo MIURA
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Title:
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METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE MEMBER, RESIN-ENCAPSULATED ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
KYOTO-SHI, KYOTO, JAPAN 601-8105 |
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MUNCY, GEISSLER, OLDS & LOWE, P.C. |
4000 LEGATO ROAD |
SUITE 310 |
FAIRFAX, VA 22033 |
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