Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/15/2017
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Application #:
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14572636
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Filing Dt:
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12/16/2014
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Inventors:
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Mark Bergman, Joan K. Vrtis, Michael James Glickman
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Title:
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NANO-COPPER VIA FILL FOR ENHANCED THERMAL CONDUCTIVITY OF PLATED THROUGH-HOLE VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6201 AMERICA CENTER DR. |
| SAN JOSE, CALIFORNIA 95002 |
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| THOMAS B. HAVERSTOCK |
| 162 N WOLFE ROAD |
| SUNNYVALE, CA 94086 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 520 MARYVILLE CENTRE DRIVE |
| SUITE 400 |
| ST. LOUIS, MISSOURI 63141 |
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| OLGA AYALA |
| 600 THIRD AVENUE |
| 42ND FLOOR |
| NEW YORK, NY 10016 |
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