Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/29/2017
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Application #:
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13904401
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Filing Dt:
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05/29/2013
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Inventors:
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HeeJo Chi, NamJu Cho, HanGil Shin, Kyung Moon Kim
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH JOINT ASSEMBLY AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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ISHIMARU & ASSOCIATES LLP |
2055 GATEWAY PLACE |
SUITE 700 |
SAN JOSE, CA 95110 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#04-08/09 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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WONG & REES LLP |
4677 OLD IRONSIDES DRIVE |
SUITE 370 |
SANTA CLARA, CA 95054 |
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