Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/26/2017
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Application #:
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14314043
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Filing Dt:
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06/25/2014
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Publication #:
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Pub Dt:
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11/06/2014
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Inventors:
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Shunsaku Yoshikawa, Yoshie Yamanaka, Tsukasa Ohnishi, Seiko Ishibashi, Koji Watanabe et al
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Title:
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LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN |
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| MICHAEL TOBIAS |
| 1629 K STREET NW |
| SUITE 300 |
| WASHINGTON, DC 20006 |
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