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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/10/2017
Application #:
14021938
Filing Dt:
09/09/2013
Publication #:
Pub Dt:
03/12/2015
Inventors:
Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui et al
Title:
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTERNING AND REMOVAL
Assignment: 1
Reel/Frame:
032567/0526Recorded: 03/31/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/13/2014
Exec Dt:
01/14/2014
Exec Dt:
01/14/2014
Exec Dt:
01/14/2014
Exec Dt:
01/14/2014
Exec Dt:
03/27/2014
Exec Dt:
01/13/2014
Exec Dt:
01/14/2014
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085-4040

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