Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2017
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Application #:
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14332643
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Filing Dt:
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07/16/2014
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Publication #:
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Pub Dt:
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01/21/2016
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Inventors:
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Yeh-Chieh WANG, Jiun-Rong PAI, Hsu-Shui LIU, Cheng-Lung LEE, Kuang-Chung LIOU
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Title:
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WAFER CHUCK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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