Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2017
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Application #:
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14688895
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Filing Dt:
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04/16/2015
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Publication #:
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Pub Dt:
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10/20/2016
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Inventors:
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Yi-Chun Huang, Chih-Hsiang Yao, Jye-Yen Cheng, Wen-Chuan Chiang, Ying-Wen Huang
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Title:
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Interconnect Structures and Methods of Forming Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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