Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/24/2017
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Application #:
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14389668
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Filing Dt:
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09/30/2014
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Publication #:
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Pub Dt:
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02/26/2015
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Inventors:
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Teruo Komatsu, Ryo Matsubayashi
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Title:
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COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND JOINING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 1, INCUBATOR, OSAKA CITY UNIVERSITY |
| 3-138, SUGIMOTO 3-CHOME, SUMIYOSHI-KU |
| OSAKA-SHI, OSAKA-FU, JAPAN 558-8585 |
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| 2-1, OHTEMACHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-0004 |
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| DLA PIPER US LLP |
| 2000 AVENUE OF THE STARS |
| SUITE 400 NORTH TOWER |
| LOS ANGELES, CA 90067-4704 |
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