Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/31/2017
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Application #:
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14302728
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Filing Dt:
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06/12/2014
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Publication #:
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Pub Dt:
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10/02/2014
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Inventors:
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Bor-Ping Jang, Chien Ling Hwang, Meng-Tse Chen, Chen-Hua Yu, Yeong-Jyh Lin, Chung-Shi Liu et al
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Title:
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WAFER LEVEL TRANSFER MOLDING AND APPARATUS FOR PERFORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, LLP |
| 17950 PRESTON RD. |
| SUITE 1000 |
| DALLAS, TX 75252 |
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