Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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13273669
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Filing Dt:
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10/14/2011
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Publication #:
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Pub Dt:
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04/19/2012
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Inventors:
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Dirk Taillaert, Diederik Vermeulen, Jonathan Schrauwen, Gunther Roelkens
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Title:
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Coupling Methods and Systems Using a Taper
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| ST. PIETERSNIEUWSTRAAT 25 |
| GENT, BELGIUM 9000 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE |
| CHICAGO, IL 60606 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 N. STETSON AVENUE |
| CHICAGO, IL 60601-6731 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TECHNOLOGIEPARK 3, 9052 ZWIJNAARDE |
| REGISTER OF LEGAL ENTITIES VAT |
| ZWIJNAARDE, BELGIUM |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 N. STETSON AVENUE |
| CHICAGO, IL 60601-6731 |
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