Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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15298221
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Filing Dt:
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10/19/2016
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Inventors:
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Jui-Chieh Chiu, Chih-Wen Huang, You-Cheng Lai
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Title:
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Semiconductor Package and Manufacturing Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK, KUEI SHAN DIST. |
TAO YUAN CITY, TAIWAN |
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WINSTON HSU |
P.O.BOX 506 |
MERRIFIELD, VA 22116 |
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