Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/05/2017
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Application #:
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14911455
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Filing Dt:
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02/10/2016
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Publication #:
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Pub Dt:
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06/29/2017
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Inventors:
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Keun Hoon YOO, Jeong Su CHOI, Won Seok LEE, Seok Goo JANG, Roo Da LEE, Ho Hoon KIM et al
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Title:
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THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN MOLDED ARTICLE PREPARED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 150-721 |
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| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST. SW |
| SUITE 580 |
| MOUNTLAKE TERRACE, WA 98043 |
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