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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/12/2017
Application #:
14960180
Filing Dt:
12/04/2015
Inventor:
Minghao Shen
Title:
WAFER-LEVEL FAN-OUT WIREBOND PACKAGES
Assignment: 1
Reel/Frame:
037222/0483Recorded: 12/07/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/04/2015
Assignee:
101 INNOVATION DRIVE
SAN JOSE, CALIFORNIA 95134
Correspondent:
G VICTOR TREYZ
870 MARKET ST SUITE 984
SAN FRANCISCO, CA 94102

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