Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/12/2017
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Application #:
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14831463
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Filing Dt:
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08/20/2015
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Publication #:
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Pub Dt:
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10/06/2016
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Inventor:
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Hyeong Seok CHOI
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Title:
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SEMICONDUCTOR PACKAGES WITH SOCKET PLUG INTERCONNECTION STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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WILLIAM PARK & ASSOCIATES LTD. |
930 N. YORK ROAD, SUITE 201 |
HINSDALE, IL 60521 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9330 LBJ FREEWAY |
SUITE 900 |
DALLAS, TEXAS 75243 |
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ROBERT D. LEONARD |
VOLPE KOENIG |
30 SOUTH 17TH STREET, 18TH FLOOR |
PHILADELPHIA, PA 19103 |
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