Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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15210343
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Filing Dt:
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07/14/2016
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Publication #:
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Pub Dt:
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01/18/2018
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Inventors:
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Chin-Hua WANG, Po-Yao LIN, Shu-Shen YEH, Kuang-Chun LEE, Shin-Puu JENG, Shyue-Ter LEU et al
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Title:
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CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 251 LITTLE FALLS DRIVE |
| WILMINGTON, DELAWARE 19808-1674 |
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| MARK SPOLYAR |
| ALMANAC IP ADVISORS LLP |
| 22 HOFFMAN AVE |
| SAN FRANCISCO, CA 94114 |
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