Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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14990366
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Filing Dt:
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01/07/2016
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Publication #:
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Pub Dt:
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07/13/2017
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Inventors:
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I-Chia LIN, Chieh-Chen FU, Kuo Hsien LIAO, Cheng-Nan LIN
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Title:
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SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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FOLEY & LARDNER |
3000 K STREET N.W. |
SUITE 600 |
WASHINGTON, DC 20007 |
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09/21/2024 07:53 PM
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