Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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14810414
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Filing Dt:
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07/27/2015
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Publication #:
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Pub Dt:
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02/04/2016
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Inventors:
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Jung Woo KO, Jeong Hun OH, Kyu Bin PARK, Hyun Kook PARK, Heung Su JUNG
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Title:
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TIN ALLOY ELECTROPLATING SOLUTION FOR SOLDER BUMPS INCLUDING PERFLUOROALKYL SURFACTANT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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21-101, SANDAN-GIL, JEONUI-MYEON |
SEJONG-SI, KOREA, REPUBLIC OF 339-851 |
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REVOLUTION IP, PLLC |
1940 DUKE ST. |
SUITE 200 |
ALEXANDRIA, VA 22314 |
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