Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
01/23/2018
|
Application #:
|
15015734
|
Filing Dt:
|
02/04/2016
|
Publication #:
|
|
Pub Dt:
|
08/18/2016
| | | | |
Inventors:
|
Qin-Jia CAI, Da-Jung CHEN
|
Title:
|
PACKAGING PROCESS OF ELECTRONIC COMPONENT
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
4 KAKI BUKIT AVENUE 1,#05-04 |
SINGAPORE, SINGAPORE 417939 |
|
|
|
KIRTON MCCONKIE |
36 SOUTH STATE STREET |
1900 KEY BANK TOWER |
SALT LAKE CITY, UT 84111 |
|
|
Search Results as of:
09/24/2024 10:21 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|