Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/23/2018
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Application #:
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15071215
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Filing Dt:
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03/16/2016
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Publication #:
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Pub Dt:
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12/08/2016
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Inventors:
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Le LIANG, Shou-Yu HONG, Zhen-Qing ZHAO
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Title:
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PACKAGE MODULE HAVING EXPOSED HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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31-1 XINGBANG ROAD, GUISHAN INDUSTRIAL ZONE |
TAOYUAN CITY, TAIWAN 33370 |
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CKC & PARTNERS CO., LTD. |
12TH FLOOR, RUTTONJEE HOUSE |
11 DUDDELL STREET |
HONG KONG, HONG KONG |
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