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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/27/2018
Application #:
14986275
Filing Dt:
12/31/2015
Publication #:
Pub Dt:
07/28/2016
Inventors:
Zwei-Mei LEE, Bo-Jr HUANG, Chi-Jih SHIH, Jia-Wei FANG
Title:
METHODS FOR DISTRIBUTING POWER IN LAYOUT OF IC
Assignment: 1
Reel/Frame:
037392/0137Recorded: 12/31/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/30/2015
Exec Dt:
12/30/2015
Exec Dt:
12/30/2015
Exec Dt:
12/30/2015
Assignee:
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339

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