Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2018
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Application #:
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15054097
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Filing Dt:
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02/25/2016
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Publication #:
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Pub Dt:
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03/30/2017
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Inventors:
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You Jin OH, Eun Dong KIM, Jong Won LEE, Jai Kyoung CHOI
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Title:
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WAFER LEVEL FAN-OUT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31094 |
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| RENAISSANCE IP LAW GROUP LLP (PIP) |
| 9600 SW OAK ST. SUITE 560 |
| PORTLAND, OR 97223 |
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