Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/06/2018
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Application #:
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14970242
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Filing Dt:
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12/15/2015
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Publication #:
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Pub Dt:
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06/15/2017
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Inventors:
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Shih-Ming Chang, Chih-Ming Lai, Tien-I Bao, Ru-Gun Liu, Tsai-Sheng Gau, Chung-Ju Lee et al
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Title:
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Via Connection to a Partially Filled Trench
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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HAYNES AND BOONE, LLP |
2323 VICTORY AVENUE, SUITE 700 |
IP SECTION |
DALLAS, TX 75219 |
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05/28/2024 10:57 AM
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