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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/13/2018
Application #:
15238559
Filing Dt:
08/16/2016
Publication #:
Pub Dt:
01/05/2017
Inventors:
Qing Liu, John H. Zhang
Title:
METHODS FOR FABRICATING AN INTEGRATED CIRCUIT HAVING VERTICALLY OVERLAPPING SHORT AND LONG CHANNEL FINFETS
Assignment: 1
Reel/Frame:
068433/0816Recorded: 07/18/2024Pages: 17
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/27/2024
Assignee:
CHEMIN DU CHAMP-DES-FILLES 39
PLAN-LES-OUATES
GENEVA, SWITZERLAND 1228
Correspondent:
RAJ K. KRISHNAN
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300
COPPELL, TX 75019

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