Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/20/2018
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Application #:
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15521426
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Filing Dt:
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04/24/2017
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Publication #:
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Pub Dt:
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10/26/2017
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Inventors:
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Keisuke ARAMAKI, Hiroki KANAYA, Masahide DAIMON
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Title:
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Heat Conduction Sheet, Heat Conduction Sheet Manufacture Method, Heat Radiation Member, and Semiconductor Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| GATE CITY OSAKI, EAST TOWER 8TH FLOOR, 11-2, OSAKI 1-CHOME |
| SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| CARMODY TORRANCE SANDAK HENNESSEY LLP |
| 195 CHURCH ST |
| PO BOX 1950 |
| NEW HAVEN, CT 06509-1950 |
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Assignment:
2
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| 1724 SHIMOTSUBOYAMA, SHIMOTSUKE-SHI |
| TOCHIGI, JAPAN 323-0194 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
3
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 4-4, NISHITEMMA 2-CHOME |
| KITA-KU, OSAKA-SHI, OSAKA, JAPAN 5308565 |
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| ELLEN S. SIMPSON |
| COLSON LAW GROUP |
| 5555 MAIN STREET |
| BUFFALO, NY 14221 |
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