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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9926639
Issue Dt:
03/27/2018
Application #:
13167001
Filing Dt:
06/23/2011
Publication #:
20120012465
Pub Dt:
01/19/2012
Inventors:
HOON KIM, WEI TI LEE, SANG HO YU, SESHADRI GANGULI, HYOUNG-CHAN HA, SANG HYEOB LEE
Title:
METHODS FOR FORMING BARRIER/SEED LAYERS FOR COPPER INTERCONNECT STRUCTURES
Assignment: 1
Reel/Frame:
026589/0284Recorded: 07/14/2011Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIM, HOON
Exec Dt:
07/05/2011
LEE, WEI TI
Exec Dt:
07/09/2011
YU, SANG HO
Exec Dt:
07/05/2011
GANGULI, SESHADRI
Exec Dt:
07/05/2011
HA, HYOUNG-CHAN
Exec Dt:
06/29/2011
LEE, SANG HYEOB
Exec Dt:
07/05/2011
Assignee:
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ALAN TABOADA
1030 BROAD STREET
SUITE 203
SHREWSBURY, NJ 07702

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