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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/10/2018
Application #:
15322171
Filing Dt:
12/26/2016
Publication #:
Pub Dt:
05/11/2017
Inventors:
Eckhard DITZEL, Siegfried WALTER, Michael BENEDIKT, Udo BECKER
Title:
STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODULE WITH A CHIP CARRIER OF THIS TYPE, ELECTRONIC DEVICE WITH A MODULE OF THIS TYPE, AND METHOD FOR PRODUCING A SUBSTRATE
Assignment: 1
Reel/Frame:
041184/0390Recorded: 02/06/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/10/2017
Exec Dt:
01/16/2017
Exec Dt:
01/16/2017
Exec Dt:
01/10/2017
Assignee:
HERAEUSSTRASSE 12-14
HANAU, GERMANY 63450
Correspondent:
HASSAN ABBAS SHAKIR
575 MADISON AVENUE
KATTEN MUCHIN ROSENMAN LLP
NEW YORK, NY 10022-2585

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