Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/10/2018
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Application #:
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11860922
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Filing Dt:
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09/25/2007
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Publication #:
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Pub Dt:
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05/05/2011
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Inventors:
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OSWALD SKEETE, RAVI MAHAJAN, JOHN GUZEK
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Title:
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INTEGRATED CIRCUIT PACKAGES INCLUDING HIGH DENSITY BUMP-LESS BUILD UP LAYERS AND A LESSER DENSITY CORE OR CORELESS SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| M/S SC4-202 |
| SANTA CLARA, CALIFORNIA 95052-5326 |
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| INTEL CORPORATION C/O INTELLEVATE LLC |
| P.O. BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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