Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/10/2018
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Application #:
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15203418
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Filing Dt:
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07/06/2016
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Publication #:
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Pub Dt:
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03/16/2017
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Inventors:
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Chi-Chin LIEN, I-Hsuan PENG, Wei-Che HUANG, Tzu-Hung LIN, Nai-Wei LIU, Ching-Wen HSIAO
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Title:
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FAN-OUT PACKAGE STRUCTURE HAVING EMBEDDED PACKAGE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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