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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/08/2018
Application #:
15343248
Filing Dt:
11/04/2016
Publication #:
Pub Dt:
05/10/2018
Inventors:
Risto Ilkka Tuominen, Arun Virupaksha Gowda
Title:
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND METHOD OF MANUFACTURING THEREOF
Assignment: 1
Reel/Frame:
040220/0059Recorded: 11/04/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/09/2016
Exec Dt:
09/09/2016
Assignee:
1 RIVER ROAD
SCHENECTADY, NEW YORK 12345
Correspondent:
ZIOLKOWSKI PATENT SOLUTIONS GROUP, SC
136 SOUTH WISCONSIN STREET
PORT WASHINGTON, WI 53074

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