Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/08/2018
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Application #:
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15343248
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Filing Dt:
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11/04/2016
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Publication #:
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Pub Dt:
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05/10/2018
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Inventors:
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Risto Ilkka Tuominen, Arun Virupaksha Gowda
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Title:
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ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND METHOD OF MANUFACTURING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 RIVER ROAD |
| SCHENECTADY, NEW YORK 12345 |
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| ZIOLKOWSKI PATENT SOLUTIONS GROUP, SC |
| 136 SOUTH WISCONSIN STREET |
| PORT WASHINGTON, WI 53074 |
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