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Patent Assignment Abstract of Title
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Total Assignments: 6
Patent #:
9968700
Issue Dt:
05/15/2018
Application #:
14975200
Filing Dt:
12/18/2015
Publication #:
20160101429
Pub Dt:
04/14/2016
Inventors:
Joseph Edward Scheffelin, Timothy James HOEKSTRA, Stephan Gary Bush, Simon Dodd et al
Title:
MICROFLUIDIC DELIVERY SYSTEM AND METHOD
Assignment: 1
Reel/Frame:
045396/0117Recorded: 03/30/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
DODD, SIMON
Exec Dt:
07/05/2016
Assignee:
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300
COPPELL, TEXAS 75019
Correspondent:
KAREN M. HENCKEL
701 FIFTH AVENUE, SUITE 5400
SEED IP LAW GROUP LLP
SEATTLE, WA 98104
Assignment: 2
Reel/Frame:
045396/0201Recorded: 03/30/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SCHEFFELIN, JOSEPH EDWARD
Exec Dt:
07/06/2016
HUNT, DAVE S.
Exec Dt:
07/05/2016
HOEKSTRA, TIMOTHY JAMES
Exec Dt:
07/05/2016
Assignee:
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2
AGRATE BRIANZA, ITALY 20864
Correspondent:
KAREN M. HENCKEL
701 FIFTH AVENUE, SUITE 5400
SEED IP LAW GROUP LLP
SEATTLE, WA 98104
Assignment: 3
Reel/Frame:
045396/0210Recorded: 03/30/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHERMAN, FAIZ
Exec Dt:
02/05/2018
BUSH, STEPHAN GARY
Exec Dt:
02/05/2018
Assignee:
THE PROCTER & GAMBLE COMPANY
ONE PROCTER & GAMBLE PLAZA
CINCINNATI, OHIO 45202
Correspondent:
KAREN M. HENCKEL
701 FIFTH AVENUE, SUITE 5400
SEED IP LAW GROUP LLP
SEATTLE, WA 98104
Assignment: 4
Reel/Frame:
045396/0244Recorded: 03/30/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
THE PROCTER & GAMBLE COMPANY
Exec Dt:
02/20/2018
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
SCHIPHOL BOULEVARD 265
SCHIPHOL, NETHERLANDS 1118BH
Correspondent:
KAREN M. HENCKEL
701 FIFTH AVENUE, SUITE 5400
SEED IP LAW GROUP LLP
SEATTLE, WA 98104
Assignment: 5
Reel/Frame:
058835/0877Recorded: 01/31/2022Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS, INC.
Exec Dt:
01/21/2022
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39
PLAN-LES-OUATES
GENEVA, SWITZERLAND 1228
Correspondent:
SEED IP LAW GROUP LLP
701 5TH AVE
SUITE 5400
SEATTLE, WA 98104
Assignment: 6
Reel/Frame:
059246/0754Recorded: 03/11/2022Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS S.R.L.
Exec Dt:
02/02/2022
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39
PLAN-LES-OUATES
GENEVA, SWITZERLAND 1228
Correspondent:
SEED INTELLECTUAL PROPERTY LAW GROUP LLP
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104

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